ASAP-1 IPS Backside Preparation & Mechanical Decapsulation
Every lab can now produce accurate, reproducible, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decap. is now straightforward and accurate.
ULTRAPOL advance Lapping and Polishing Machine
ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance's unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC's.